【工作內容】
1. Define product process flow with ME, TE.
2.BOM and EC change management in PDM.
3. Lead risk assessment with teams for each PCN / PCR.
4. Host meeting for sample build meeting and debug meeting.
5. Coordinate Yield Improvement to meet phase gating.
6. 2nd sources buy off activities and schedule follow up.
7. Coordinate SFIS/MES route and MFG data traceability setup.
8. DA6.3 /IATF16949 audit preparing and co-work with QA leader.
【加分條件】
1. 具產品工程師或專案管理師2年工作經驗以上佳
2. 具封測廠2年工作經驗以上佳
3. 具Power module製程設計，料開發或產品開發經驗佳
4. 具半導體封裝相關經驗(etc: die attach, wire bonding, molding)佳
5. Toeic 600分以上佳
6. 具日檢與日語能力者尤佳
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【職缺投遞】https://usiglobal.freshteam.com/jobs