1. Conduct new manufacturing processes and material development for module parameter adjustment and process stability maintenance. 2. Product construct design and quotation. 3. Evaluate engineering equipment or tools for manufacturing processes. 4. New technology application and development. Qualification: 1. Experienced in IGBT Power Module Assembly or Power Discrete Assembly 2. Experienced in wire bonding (Ball bond: gold wire, copper wire, Wedge bond, thick aluminum wire, thick copper wire) 3. Experienced in die bonding (glue bonding, alloy bonding, and sintering) 4. Experienced in encapsulation (EMC Molding, Epoxy Potting, Silicone Potting), etc. 5. Applicants with experience in the SMT process are preferred #LI-JH #LI-ERIK #LI-ONSITE Apply now: https://usiglobal.freshteam.com/jobs |